Multiple high speed (Fuji) fine pitch and flexible (Mydata) SMT Lines Experienced volume BGA and micro BGA placement Full Box Build/Total Integration capability, ultrasonic welding, conformal coating Programming of Microprocessors, Micro Controllers, Memory Devices and PLD's In-Circuit test: Genrad, Teredyne, Power Test In-circuit, Functional, Burn-In and Systems Level Test Functional, Burn-In and Systems Level Test Agency approvals: UL, CUL, CCC, CSA, TUV, Demko RoHS Compliant Three manufacturing facilities within a ninety minute drive from Hong Kong. Combined square footage of 750,000 square feet, fully air conditioned and humidity controlled manufacturing facilities Utilizes ERP system for materials, manufacturing and data collection. Experienced international procurement and logistics professionals. Design Support DFT and DFM Value Engineering BOM Optimization & Cost reduction Supply Base Management Worldwide procurement of material Multi-sourcing of components – single source alternatives, obsolete components, materials, manufacturing and data collection.